iFixit Thermal Putty is a soft, gap-filling compound that flows into uneven spaces other pads or pastes can’t reach. It ships in a convenient 6 g syringe for precise, mess-free application on GPUs, VRAM, power-delivery ICs, and other multi-height components. Unlike traditional pads, this fully-cured putty compresses down to a 0.1 mm bond-line, delivers reliably low thermal resistance, and won’t dry out or bleed oil over time.

Whether you’re repasting a laptop, refreshing an aging game console, or reassembling your favorite hand-held gaming device, count on iFixit Thermal Putty to keep your hardware cool and quiet.

• High thermal conductivity: 6 W/m·K for efficient heat transfer
• Ultra-thin bond-line (≥ 0.1 mm) reduces thermal resistance on uneven boards
• Ready-to-use syringe no mixing or curing required
• Wide service temperature –55 °C to +200 °C covers extreme ambient conditions
• RoHS-compliant, UL 94 V-0 rated, and electrically insulating (> 6 kV/mm)
• Thermal Conductivity: ASTM D5470 6.0 W/m·K
• Density: ASTM D792 3.5 g/cm³
• Breakdown Voltage: ASTM D149 > 6000 V/mm
• Volume Resistivity: ASTM D257 10¹³ Ω·cm
• Flammability: UL 94 V-0
• Shelf Life: 18 months @ 25 °C / 50 % RH